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19 September 2006


NanoWorld buys Suss MicroTec’s ELAN CB6L

Suss MicroTec of Munich, Germany has received an order for its recently launched ELAN CB6L wafer bonding system from NanoWorld Services, located in Erlangen, Germany.  

Part of  the Swiss NanoWorld Group, NanoWorld Services specializes in the development and fabrication of micro-technological products, such as probes for Scanning Probe Microscopy, based on semiconductor fabrication methods.

“Our main business is turning customer's MEMS ideas into MEMS products by providing an inherently tight integration of MEMS design, process development and production,” says Joerg Diebel, CEO at NanoWorld Services. “The ELAN offers the flexibility to serve our various customers’ needs as well as the precision to develop new products and processes with stringent post-bond alignment specifications.”

Michael Kipp, president, Wafer Bonder Division, Suss MicroTec, added: “Our manual wafer bonding solution facilitates MEMS R&D and process development, and because it uses essentially the same technology and user-friendly software as our fully automated wafer bonding cluster tools, it allows for a smooth transition to volume production.”

The ELAN CB6L is designed for R&D, and pre-production wafer bonding markets. It offers the same core technology as Suss’ fully automated bonders, including precise temperature and force during bonding, and computer controlled wafer processing.  The ELAN is suited for MEMS, optoelectronic, advanced packaging, and SOI applications.

Contact: brigitte.wehrmann@suss.com

Visit: http://www.suss.com