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6 November 2009

 

SemiLEDs launches I-core LED chips

SemiLEDs Corp of Boise, ID, USA (which has chip fabrication facilities in Hsinchu Science Park, Taiwan) has launched the new I-core (IC) LED, a new chip that will be featured in the firm’s blue (white), green and ultraviolet ultra-high-brightness LED product portfolio. The IC is the first product released in SemiLEDs’ I-core series of LEDs, which are designed to provide further improvements in brightness, reliability and overall efficiency.

The I-core is designed with new electrodes that are convenient for wire bonding. SemiLEDs says that advantages include improved reliability, delivered through the optimization of stress management for the chip at high-current operation. The firm claims that the IC LED is also significantly brighter, as its robust design results in much improved light extraction. An optimized white-light I-core LED chip in a 40 mil package can deliver 120lm/W, which is a significant improvement over the previous version.

Advantages are further emphasized through SemiLEDs’ patented and proprietary ‘metal vertical photon’ (Mvp) LED chip technology, which features a vertical structure with a flexible copper alloy base for effective thermal dissipation.

See related items:

SemiLEDs adds capacity to meet demand for high-end lighting applications

SemiLEDs’ third Taiwan plant expands monthly capacity to 15m chips

Search: SemiLEDs LEDs

Visit: www.semileds.com