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11 November 2009


SemiLEDs plans China LED wafer and chip fab

High-brightness LED chip maker SemiLEDs Corp of Boise, ID, USA (which has chip fabrication facilities in Hsinchu Science Park, Taiwan) plans to establish a new LED wafer and high-power LED chip fabrication plant in Foshan, Guangdong Province, China.

The plant will be developed in three stages, with the initial stage seeing an investment of $96m and set to be ready for full-scale production by October 2010. Initial monthly production capacity will be 20 million 1mm x 1mm LED chips per month, with investment and production expected to grow three-fold within three years.

“Developing a fabrication facility in the NanHai Economic Development Zone will allow SemiLEDs to be in the center of the LED industry in China,” says chairman & CEO Trung Doan. “NanHai has invested RMB$2bn to support the industry’s development. The government provides great support and, combined with the local industry, it makes a perfect match,” he adds.

SemiLEDs reckons that the China plant will enable it to provide further service and support to the growing number of firms involved in solid-state lighting throughout China while boosting production to meet rapidly growing global demand. SemiLEDs supplies LED chips to many packaging firms in China focusing on solid-state lighting such as street lights, commercial and residential lighting.

SemiLEDs’ proprietary blue (white), green and UV ‘metal vertical photon’ (Mvp) LED chip design features a vertical LED structure with a patented copper alloy base that provides what is claimed to be the best thermal resistance on the market (0.4°C/W) as well as electrical and optical advantages such as greater luminous efficacy and longer lumen maintenance.

See related items:

SemiLEDs adds capacity to meet demand for high-end lighting applications

SemiLEDs’ third Taiwan plant expands monthly capacity to 15m chips

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