6 July 2010


EV Group launches EVG610 mask and bond aligner

Wafer bonding and lithography equipment maker EV Group (EVG) of St. Florian, Austria has introduced the EVG610 mask and bond aligner, specifically designed for the firm’s university and research customers.  

The EVG610 provides wider access to EVG's core alignment technology platform used throughout its latest mask and bond aligner systems. Designed to offer the flexibility of EVG’s EVG620 automated mask and bond aligner , which is targeted for volume production, the EVG610 eliminates costly features, such as automation, which may not be needed in a research facility, says the firm.

"EV Group has been working with research facilities for 30 years, giving us insight into the unique requirements of smaller-scale university research and production facilities.  That is why we continue to roll out products like the EVG610 to make sure that students and first-time users have access to affordable systems with superior technology features that may not otherwise be available in lower-cost models.  This latest addition is an integral part of our mask aligner and bond aligner product families, and completes our portfolio spanning the entire manufacturing chain—from R&D all the way to full-scale, high-volume production environments," says EVG’s executive technology director, Paul Lindner.

The new system provides mask alignment technology with the highest overlay accuracy enabling the best possible exposure, while its bond alignment capability offers alignment accuracy that maximizes process windows, both ensuring higher yields, says EVG.  Furthermore, the EVG610 enables researchers to seamlessly migrate their processes to volume production environments.

The EVG610 is a flexible R&D system that can process substrate pieces and wafers up to 200 mm.  It is designed to support a wide variety of processes such as UV-nanoimprint lithography (UV-NIL) and fine patterning, wafer bumping and chip-scale packaging for MEMS, integrated circuit and compound semiconductor devices.

Other key features of the EVG610 system include:

  • Option to combine mask and bond alignment capabilities optimizes total cost of ownership.
  • Flexible configurations available from pieces up to  4-, 6- or 8-inch substrates.
  • Bottom-side alignment capability, supporting back side lithography and bond alignment processes.
  • Unmatched exposure light uniformity at wafer level (down to +/-1.5 percent).
  • Processes are fully compatible to EVG production mask and alignment bonding systems.
  • Flexible multi-user system with multi-language capability.
  • Maintenance-free and high-precision monolithic air bearing stage.
  • Windows-based user interface.

See: EV Group Company Profile

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