2 March 2010


EVG ships wafer bonding systems to the University of Michigan's Lurie Nanofabrication Facility

Wafer bonding and lithography equipment maker EV Group (EVG) of St. Florian, Austria has shipped two wafer bonding systems (EVG 520IS and EVG510) to the University of Michigan's Lurie Nanofabrication Facility (LNF), a center for MEMS and microsystems research and a member of the National Nanotechnology Infrastructure Network (NNIN), which is supported by the National Science Foundation.

With a wafer bonder and aligner already installed at the facility, the new systems will increase the level of the university's overall MEMS research efforts by providing high-force wafer bonding capabilities, says EVG.  The firm adds that the order is strategic, as it poises EVG for a long-term relationship with another major university with a strong MEMS research focus.

Installation of both bonding systems at the customer site is due to be completed in Q1/2010.  The bonders will be used for a wide-range of MEMS-related research in fields such optoelectronics.  Both systems offer high-force bonding capabilities that enable metal-to-metal bonding and specifically allow triple stack anodic bonding, says EVG. 

"As a member of NNIN, we are always looking for the most advanced technical processing capabilities - not only for our own research efforts, but also in the interest of other research groups dedicated to advancing MEMS technology," said Professor Ken Wise of the University of Michigan and Director of the Lurie Nanofabrication Facility.  "Following thorough evaluation of a number of wafer bonding systems, we selected EVG's bonding solutions for their superior technology capabilities.  The combination of EVG's demo results, strong support network and the affordability of their system were all critical to our decision."

See: EV Group Company Profile

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