ARM Purification

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27 May 2015

Flip Chip Opto launches 2000W COBs based on patented 3-Pad LED flip chips with Pillar Metal Core PCBs

LED lighting technology firm Flip Chip Opto Inc of Fremont, CA, USA has launched 2000W high-power LED chip-on-board (COB) products using its patented 3-Pad LED flip chips and Pillar Metal Core printed-circuit board (P-MCPCB) technologies.

The 2000W P310-15S40P COB features 600 of 3-Pad LED chips embedded on a single P-MCPCB with a low-temperature bonding process. The extremely low thermal resistance of only 0.003°C/W enables illumination designers to apply inexpensive (e.g. smaller) thermal management solutions, enhancing the lumen-per-dollar performance, says the firm.

Standard options include a correlated color temperature (CCT) of 2700K, 3000K, 4000K, 5000K or 5600K and a color rendering index (CRI) of 70, 80, 90 or 95. Designers can also choose to boost performance by driving the modules at higher currents, up to an absolute maximum of 3200W.

The rectangular shape is suitable for luminaires utilizing rectangular reflectors common for ski resorts, stadium, sport complex and golf course luminaires. Custom and modified versions are available upon request.

See related items:

Flip Chip Opto launches 300W, 600W and 960W chip-on-board lighting modules

Flip Chip Opto launches chip-on-board LEDs with pillar metal core PCBs for high power


Visit: www.fcopto.com

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