11 July 2016

EVG launches automated metrology system for advanced packaging, MEMS and photonics manufacturing

EV Group of St Florian, Austria (a supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor applications) has launched the EVG50 automated metrology system.

Designed to support the increasingly stringent manufacturing requirements for advanced packaging, microelectromechanical systems (MEMS) and photonics applications, the EVG50 performs high-resolution non-destructive multi-layer thickness and topography measurement, as well as void detection, in bonded wafer stacks and in photoresists used in optical lithography. The system measures layers down to 2 microns in thickness, can inspect up to 1 million points, and achieves throughputs of up to 55 300mm wafers per hour. This combination of extremely high resolution and high throughput provides cost-efficient full-wafer inspection that enables device makers to improve their wafer bonding and lithography processes, as well as achieve higher yields, EVG claims.

"The semiconductor industry is witnessing a trend toward total control and monitoring of all production processes," notes corporate technology director Dr Thomas Glinsner. "Mid-end-of-line and back-end packaging processes face tighter process constraints at levels previously seen only in front-end-of-line wafer processing. This is creating an urgent need for highly accurate in-line metrology that can provide critical process data quickly and cost-effectively," he adds. "The EVG50 is an important addition to our suite of metrology solutions that achieves these goals at speeds and resolutions."

The standalone EVG50 system is based on the firm's existing in-line metrology module (IMM), which is available as an option in EVG's line of 300mm process equipment and has been widely implemented in high-volume manufacturing. The EVG50 complements the versatile EVG40NT measurement system (said to be the industry standard for bond overlay inspection) to meet increased demand for full-area layer thickness and topography measurement in critical applications. The new system's high throughput, accuracy and repeatability - even at ultra-high resolutions - enables cost-effective, 100% inspection of production wafers, resulting in improved process control, the firm claims.

The EVG50's versatility allows it to measure coating thickness for lithography as well as wafer bow and warp, and make void inspections for a bonded wafer stack on the same system, while its low-contact edge handling enables particle-free, full-area wafer inspection. Regarding flexibility, by leveraging a multi-sensor measurement mount, the system can be customized for different thickness ranges and substrates to address a wide variety of requirements. Its self-calibration capability also allows better system reproducibility and productive uptime, says the firm.

EVG's suite of metrology solutions, including the EVG50, is on display in booth #1017 (South Hall, Moscone Convention Center) at the SEMICON West show in San Francisco (12-14 July).

See: EV Group Company Profile

Tags: EV Group

Visit: www.evgroup.com/en/products/bonding/inspectionsystems/evg50