30 August 2018

MRSI unveiling one-stop shop die bonding solutions at CIOE and ECOC

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

In booth #1C66 of partner CYCAD Century Science and Technology at the 20th China International Optoelectronic Exposition (CIOE 2018) in Shenzhen (5-8 September), MRSI Systems of North Billerica, MA, USA (which manufactures fully automated, high-precision eutectic and epoxy die bonding systems) is demonstrating its ‘One Stop Shop’ capabilities.

The biggest challenge facing photonics manufacturing is how to handle high-volume and high-mix production, says MRSI. Solving this problem requires flexible high-speed automation, it adds. The firm is therefore unveiling its ‘One Stop Shop’ die bonding solutions.

During the year MRSI has expanded its die bonder product family with additional configurations. Providing the flexibility for true multi-die, multi-process, multi-product high-volume high-mix production, the high-speed products deliver what is claimed to be industry-leading speed without sacrificing flexibility, precision or reliability:

• the ultra-flexible MRSI-705 and MRSI-M3 can be used for R&D prototyping to low/medium volume;
• the ultra-fast MRSI-HVM3 and MRSI-H3 can meet high-volume requirements for all key die bonding applications in photonics manufacturing with what is claimed to be superior flexibility for multi-dies, multi-process and multi-products through one machine.

The ultra-fast product families deliver < 3μm placement accuracy for next-generation products.

“Our ‘One Stop Shop’ solutions will help our customers to enable just-in-time supply and fast-pace innovations of critical photonic component for high-growth market segments such as hyper-scale data centers, photonic sensors and 5G wireless,” reckons Dr Yi Qian, VP product management.

“MRSI Systems has been serving optoelectronic and microelectronic customers for the past 34 years and understands their requirement to scale efficiently in today’s fast-paced marketplace,” says president Michael Chalsen.

MRSI Systems is also exhibiting in booth #577 at the 44th European Conference on Optical Communications (ECOC 2018) in Rome, Italy (24-26 September).

See related items:

MRSI launches MRSI-H3LD die bonder for high-power diode laser market

MRSI launches MRSI-H3TO die bonding product family targeted at 5G wireless network supply chain

MRSI launches MRSI-HVM3P die bonder for new photonics applications

MRSI launches high-speed die bonder for photonics high-volume manufacturing

Tags: Die Bonder

Visit: www.cioe.cn/en

Visit: www.ecocexhibition.com

Visit: www.mrsisystems.com