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23 October 2019

MRSI demonstrating 1.5μm high-speed die bonding at Productronica

In parent firm Mycronic’s booth #341 in Hall A3 (SMT Cluster) of Messe München at Productronica 2019 in Munich, Germany (12-15 November), MRSI Systems of North Billerica, MA, USA (which makes fully automated, high-precision eutectic and epoxy die bonding systems) is demonstrating its MRSI-H-LD 1.5μm die bonder for high-volume manufacturing of photonics and RF/microwave devices.

The system is optimized for applications that bond large die for high-power laser diodes, industrial lasers, optical fiber amplifiers, power amplifiers, lighting and sensors. MRSI says that the versatile assembly solution enables customers to scale their business by delivering high throughput, high reliability and high flexibility.

In August, MRSI announced the upgrade of the machine accuracy to from 3μm to ±1.5μm (at 3 sigma) for the high-speed product line, under their new names MRSI-HVM and MRSI-H.

See related items:

MRSI-H/HVM-Series die bonder accuracy improved from 3μm to 1.5μm

MRSI launches MRSI-HVM3P die bonder for new photonics applications

MRSI launches high-speed die bonder for photonics high-volume manufacturing

Tags: Die Bonder

Visit: www.mrsisystems.com

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