8 December 2020
MACOM showcasing high-data-rate products at ECOC
At the European Conference on Optical Communications (ECOC) 2020 virtual conference (7–9 December), MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) is highlighting its portfolio of data-center products, including the following:
- Flip-chip quad-channel driver and transimpedance amplifier (TIA) for 400G ZR: The linear modulator driver and TIA are high-performance quad-channel flip-chip devices for operation at symbols rates up to 64GBaud. The products offer the low power consumption and the flexibility required to enable next-generation 400G ZR modules.
- PAM4 100G to 800G transimpedance amplifiers: The portfolio includes a 4x28GBaud TIA and a 1x28GBaud TIA for 53Gbps applications. These products are suitable for high-density optical interconnect solutions and are intended for 50G, 100G, 200G, 400G and 800G receivers using multi-level modulation such as PAM4.
A private meeting with MACOM’s design and applications engineers can be scheduled by registering and entering the virtual ECOC 2020 website.