26 February 2020
StratEdge highlighting high-frequency, high-power packages and assembly services at IMAPS Device Packaging, APEC and GOMACTech conferences in March
StratEdge of Santee, near San Diego, CA, USA (which designs and manufactures high-frequency and high-power packages for microwave, millimeter-wave and high-speed digital devices) is exhibiting in booth 56 at the International Microelectronics Assembly and Packaging Society’s (IMAPS) Device Packaging Conference in Fountain Hills, AZ (3-4 March), in booth 2157 at the IEEE Applied Power Electronics Conference and Exposition (APEC 2020) in New Orleans, LA (16-18 March) and in booth 202 at the annual Government Microcircuit Applications and Critical Technology conference (GOMACTech 2020) in San Diego, CA (17-18 March). At all three events the firm will have applications specialists available to discuss the many packages available for DC to 63+GHz frequencies as well as its package assembly services.
- post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages;
- The LL family of leaded laminate copper-moly-copper (CMC) base packages;
- high-power semiconductor packages;
- off-the-shelf molded ceramic packages that can be configured to meet the requirements for chips with frequencies up to 18GHz (these packages provide enhanced thermal dissipation for high-power gallium nitride devices and come in fully hermetic versions in over 200 standard outlines);
- high-reliability packages that meet stringent military applications (the packages have electrical transition designs that ensure exceptionally low electrical losses and operate efficiently, even at the highest frequencies).
“Much attention is given to GaN chips, but the package in which the GaN device is attached and the way the chip is attached to the package is often overlooked,” notes StratEdge’s VP of global sales Casey Krawiec. “It’s well known that GaN chip efficiency and reliability can be improved by creating a package environment that reduces chip-to-package junction temperatures. StratEdge has developed a proprietary eutectic die attach method that drops junction temperatures by 20 degrees when compared to standard assembly methods with ceramic packages.”