News: Suppliers
14 April 2021
Picosun increases LED and OLED production efficiency
Atomic layer deposition (ALD) thin-film coating technology provider Picosun Group of Espoo, Finland says that its P-300BV ALD system has been proven to significantly increase production efficiency for its light-emitting diode (LED) and organic LED (OLED) manufacturing customers.
Recent tests have shown that a reduced ALD process cycle time and an increased number of wafers deposited with the same film thickness resulted in almost 100% better throughput. A throughput of over 20,000 wafers per month can be reached with a batch of 100 four-inch wafers. At the same time, the process quality in terms of film thickness uniformity has remained <1% (1 sigma) within wafer, wafer-to-wafer as well as batch-to-batch (120nm TMA + H2O @ 200oC).
LED and OLED makers use ALD in production to achieve better device performance and longer product lifetimes, says Picosun. This is a result of thin, conformal, uniform and pinhole-free material layers deposited by ALD for passivation and moisture protection as well as for creating buffer and interface layers, adds the firm.
“Picosun ALD solutions have become the standard in high-volume ALD manufacturing,” says Juhana Kostamo, VP, Industrial business area of Picosun Group. “The PICOSUN P-300BV ALD system is designed especially for production of LEDs and OLEDs,” he adds. “With our experience and deep know-how in ALD we are continuously striving to minimize the total cost of ownership and ensure future-proofness for our customers.”
