25 August 2021
TRUMPF presenting new generation of datacom VCSELs and photodiodes at ECOC
In booth 501 at the European Conference on Optical Communication (ECOC 2021) in Bordeaux, France (13-16 September), TRUMPF Photonic Components GmbH of Ulm, Germany (part of the TRUMPF Group) is showcasing a new generation of vertical-cavity surface-emitting lasers (VCSELs) and photodiodes for data communications applications that have superior performance at higher temperatures due to an extensively upgraded manufacturing platform with enhanced process control and better yields.
The VCSELs feature fully passivated die and extra mechanical protection for the mesa for enhanced reliability. The matching photodiode has low dark current and an additional ground pad for better shielding, which also provides ground-signal or signal-ground options for mounting. TRUMPF says that these features enables cost savings for data-center and high-performance computing applications due to not only the reduced energy cost (from less cooling) but also fewer device-related failures in the field.
Picture: Trumpf’s new 56Gbps VCSEL and photodiode. © TRUMPF.
“While we are pleased to offer expanded temperature range on our devices up to 56Gbps today, we are now focusing on bringing our 112Gbps solutions to the market early next year, with first samples targeted for December,” says Ralph Gudde, VP of marketing & sales. In addition to the data communication market, the firm also offers solutions for consumer electronics, industrial sensing and industrial heating markets.
At ECOC, TRUMPF is demonstrating its 56Gbps VCSEL and photodiode functioning as a link in collaboration with a transimpedance amplifier (TIA) and VCSEL driver.