News: Microelectronics
8 December 2021
Microchip providing SiC MOSFETs and digital gate drivers to Mersen
Since e-mobility and renewable energy systems require power management solutions that drive performance and cost efficiencies in addition to speeding up development time, Microchip Technology Inc of Chandler, AZ, USA is collaborating with Mersen of Courbevoie, France (a global provider of power management solutions for industrial sectors including e-mobility and energy storage) on its 150kVA three-phase silicon carbide (SiC) Power Stack Reference Design.
Mersen’s three-phase SiC Power Stack Reference Design provides system designers with a complete, compact, high-power silicon carbide solution without the need for individual device sourcing, testing and qualification. The Power Stack Reference Design includes Microchip’s silicon carbide power modules and digital gate drivers and Mersen’s bus bar, fuses, capacitors and thermal management, optimally designed together in a single high-performance stack reference design. With Microchip’s 1200V MSCSM120AM042CD3AG SiC MOSFET and AgileSwitch 2ASC-12A1HP digital gate driver, the Power Stack Reference Design is said to enable engineers to rapidly develop high-voltage systems using kits pre-designed for their applications – reducing time to market by up to six months.
“Microchip customers will benefit from our collaboration with Mersen to provide silicon carbide MOSFETs and digital gate driver solutions,” says Leon Gross, VP of Microchip’s discrete product business unit. “When power inverter designers can source a proven solution, they can avoid sourcing individual parts and reduce risk through reliability – and that helps avoid downtime. Designers now have an all-in-one evaluation system.”
The Power Stack Reference Design provides 16kW per liter (kW/l) of power density and up to 130°C junction temperature (Tj), peak efficiency at 98%, with up to 20kHz switching frequency. Utilizing Microchip’s rugged SiC MOSFETs and AgileSwitch family of configurable digital gate drivers, the reference design enables engineers to select from 700V and 1200V options in currents up to 750A. Microchip also provides a choice in module construction including baseplate material, direct bonding copper (DBC) ceramic material and die-attach method.
“We worked closely with Microchip on the design and development of this silicon carbide Power Stack Reference Design given the availability of highly robust silicon carbide MOSFETs and compatible digital gate drivers from a single source,” says Philippe Roussel PhD, VP, global strategic marketing executive expert at Mersen. “Thus, we can demonstrate our ability to optimize any inverter topologies from our customers, relying on our line of highly reliable bus bars, capacitors, fuses and cooling systems. The versatile Microchip silicon carbide line-up also gives us the capacity to extend these primary specifications to higher voltage, current and switching frequency to meet every customer’s operating point needs.”
Microchip unifies in-house silicon carbide die production with its low-inductance power packaging and digital gate drivers, enabling designers to make efficient, compact and reliable end-products. These devices pair with a comprehensive portfolio of micro-controllers (MCUs), analog and MCU peripherals, plus communication, wireless and security technology, providing system designers across many applications with proven total system solutions, says the firm.
Microchip’s AgileSwitch 2ASC-12A1HP 1200V dual-channel digital gate driver with Augmented Switching technology is production qualified and fully configurable. The AgileSwitch 2ASC-12A1HP gate driver and the next-generation 2ASC-12A2HP are supported by Microchip’s Intelligent Configuration Tool (ICT), an interface allowing users to configure gate driver parameters including the gate switching profiles, system-critical monitors and controller interface settings. The ICT, a free-of-charge download, saves development time.
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