AES Semigas


21 July 2021

ASM AMICRA unveils first systems incorporating X-Celeprint’s MTP technology for high-volume heterogeneous integration of ultra-thin chips

ASM AMICRA Microtechnologies GmbH of Regensburg, Germany, a subsidiary of Singapore-based hardware and software supplier ASM Pacific Technology Ltd, has announced three new manufacturing systems that combine its high-precision die bonding technology with the micro-transfer printing (MTP) technology of X-Celeprint of Cork, Ireland to introduce what is claimed to be the first complete system to enable high-volume heterogeneous integration of ultra-thin dies onto base wafers up to 300mm in diameter.

X-Celeprint’s MTP process stacks ultra-thin dies (x-chips), which can be extremely varied (e.g. combinations of RF and power transistors, hardware assurance features, photonics, sensors, capacitors, inductors, filters, and antennas) and made using very different process nodes and technologies (including silicon-on-insulator, gallium nitride, gallium arsenide, indium phosphide and silicon germanium), to create virtually monolithic 3D ICs that improve power, performance, area, cost, time-to-market and security for a wide array of applications including high-performance computing, communications, mobile, automotive, industrial, medical, or defense systems.

ASM AMICRA has been developing ultra-high precision placement technology for almost 20 years, and has now incorporated X-Celeprint’s MTP technology into three different manufacturing systems. These are:

  • The Nova+ MTP system, which serves high-throughput needs with a fully automatic ISO 4 cleanroom class system using a 50mm x 50mm MTP stamp enabling massively parallel pick-and-place of x-chips. Placement accuracy is ±1.5µm with a 40-second cycle time.
  • The NANO MTP system, which serves markets such as photonics that require more precise placement accuracy (±0.3µm).
  • The AFC+ MTP system, which serves R&D and low-volume manufacturing markets. Placement accuracy is ±1.0µm with a 50-second cycle time.

X-Celeprint and ASM AMICRA say that they are facilitating the adoption of MTP technology through development support, including design consultation with assistance in optimizing design and processes and prototyping services to ensure successful product launches. An extensive network of suppliers, manufacturers and researchers are available to support project needs, including licensing programs.

“This agreement with X-Celeprint brings revolutionary technology to market for photonics and 3D heterogeneous integration,” reckons ASM AMICRA Microtechnologies’ managing director Dr Johann Weinhändler. “MTP technology offers efficient handling of high volumes of large arrays of ultra-thin, brittle dies, as well as the ability to integrate dies from several different source wafers. MTP technology will provide semiconductor manufacturers with a critical, additional ‘tool in the toolbox’ that supplements conventional and advanced packaging technology,” he adds.

“The ultra-high-precision capabilities of ASM AMICRA’s MTP manufacturing systems for heterogeneous integration of large arrays of ultra-thin x-chips has the potential to be a game-changer for semiconductor manufacturers seeking to extend Moore’s Law with 3D IC heterogeneous integration,” says X-Celeprint’s CEO Kyle Benkendorfer. “Enabling chip designers to combine the optimum materials and different process technologies in 3D ICs results in more powerful devices, with higher density, increased functionality, lower cost, higher yield, and faster time to market.”

Tags: Die Bonder Transfer printing