News: Suppliers
2 June 2021
Aehr receives $2.3m follow-on order for FOX-XP
Aehr Test Systems of Fremont, CA, USA says that, in its fiscal fourth-quarter (ended 31 May 2021), it shipped a follow-on order worth more than $2.3m from its lead silicon carbide (SiC) customer for a FOX-XP wafer-level test and burn-in system for high-volume production.
The customer is a Fortune 500 supplier of semiconductor devices with a significant customer base in the automotive semiconductor market, and is using the FOX-XP system for high-volume production burn-in and infant mortality screening of SiC devices at wafer level for electric vehicle (EV) power modules. The FOX-XP system is configured to test 18 SiC wafers in parallel while contacting and testing 100% of the devices on each wafer.
“This follow-on order for an additional FOX-XP system is the result of our working closely with this lead customer to achieve their test requirements and validation of our FOX-P platform and WaferPak full-wafer contactors as their production qualified solution,” notes president & CEO Gayn Erickson. “We expect this customer will order a full set of WaferPaks for this system in our new fiscal year that just began, and a significant number of FOX systems, WaferPaks and related consumables that they have forecasted to purchase from Aehr over the next several years,” he adds.
“In addition, we remain engaged in promising discussions with multiple key companies in the silicon carbide space, some of which have also publicly indicated plans for significant capacity increases,” Erickson continues.
“Silicon carbide continues to be promising as a key growth driver for Aehr, and we anticipate that silicon carbide wafer-level burn-in will become the industry standard for low cost and 100% traceability for burn-in and reliability screening.” The power semiconductor market for electric vehicles is expected to triple between 2020 and 2026, growing at a 25.7% compound annual growth rate (CAGR) to $5.6bn, according to a March report from market research firm Yole Développement. In addition, a July 2020 report from Deloitte forecasts that total EV sales will grow at a CAGR of 29% from 2.5 million in 2020 to 11.2 million in 2025, before reaching 31.1 million by 2030 and securing about 32% of the total market share for new car sales.
Available with multiple WaferPak Contactors (full-wafer test) or multiple DiePak Carriers (singulated die/module test) configurations, the FOX-XP system is capable of functional test and burn-in/cycling of integrated devices such as SiC power devices, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, gallium nitride (GaN), magnetic sensors, micro-controllers, and other leading-edge ICs in either wafer form factor (before they are assembled into single or multi-die stacked packages) or in singulated die or module form factor.
