6 May 2021
Insight SiP appoints Philippe Genin as general manager
Insight SiP of Sophia Antipolis, France - a vendor of miniature RF modules with embedded antennas, based on system-in-package technologies - has made changes in its management team to support future growth of the business.
Philippe Genin will take the role of general manager (directeur général), with responsibility for day-to-day operation of the business. Previous incumbent Michel Beghin will now focus on strategic development of the business in his role as chairman (président) of the board.
Genin has worked with Insight SiP since 2014, starting as a consultant. In 2017, he joined the firm on a full-time basis as product manager BLE. Previously, he had been general manager at engineering companies including Komax Solar in Aix-en-Provence and Chelton Telecom Microwave in Paris. He began his career at Tekelec/Temex after graduating in 1986 from the Ecole Centrale Paris as an Ingénieur, Informatique – Télécom.
“He has already proven his value to Insight SiP by making a strong impact on the success of our BLE modules,” comments Beghin. “We look forward to his leadership as we take Insight SiP into its next phase of growth.”
Insight SIP claims that its multi-radio modules offer a class-leading level of integration and miniaturization, encapsulating all RF functions, allowing customers to focus on their core application and accelerating time to market. With its R&D team based in France, Insight SIP can also offer timely technical support.
“Insight SiP has developed a world-leading, specialist expertise in ultra-miniature RF module engineering using SiP technology,” comments Genin. “Working with the team here, I want to further increase the number of engineers who make Insight SiP’s RF modules their first choice for wireless communications.”
With its R&D team based in Sophia Antipolis in the south of France, Insight SiP specializes in the miniaturization of RF modules using system-in-package technology. Its offerings include what is claimed to be the smallest complete BLE module, the first antenna-in-package, the first UWB/BLE and LoRa/BLE combo modules with integrated antennas, and the smallest microcomputer in an SD card format.