News: Optoelectronics
27 May 2021
MACOM giving live-streamed video presentations at OFC
During the Optical Networking and Communication Conference & Exhibition (OFC 2021) being held virtually on 7–10 June, the optical and high-speed data design, product management and applications engineering teams of MACOM Technology Solutions Inc of Lowell, MA, USA are hosting three live demonstrations and four technical talks. Customers have the opportunity to ask questions and interact with MACOM staff during the demonstrations.
Live streaming video demonstrations include:
DEMO #1: 200G and 400G Analog Chipsets for Data Center. MACOM is demonstrating a two-chip analog solution for short-reach 200G QSFP and 400G OSFP, as well as QSFP-DD modules and AOC data-center applications. The first chip is a 4x53Gbps PAM-4 CDR and TIA, and the second is a 4x53Gbps PAM-4 CDR and VCSEL driver. The chipset will demonstrate IEEE standard-compliant bit-error rate (BER) performance and Open Eye MSA transmit eye compliance, while displaying interoperability with an Ethernet switch.
DEMO #2: 50G Reference Design for 5G Wireless Mid Haul Applications. MACOM is demonstrating its 50G reference design for 5G wireless mid-haul applications. This demonstration will feature a complete 50G PAM-4 QSFP28 reference design, using all-MACOM components. The demo platform is a 20km optical link with single-mode fiber using 1310nm wavelength. The reference design showcases MACOM’s new PRISM-50D DSP with integrated DML driver, a 26Gbaud 1310 I-temp laser, a 26GBaud PIN photodiode, and a 26GBaud PAM-4 TIA.
DEMO #3: DWDM Laser Performance for 5G Front and Mid Haul Applications. MACOM is demonstrating its 25G DFB lasers at DWDM wavelengths, along with its driver, CDR, TIA and photodiode offerings in a transceiver built for South Korea Telecom applications. This demo will showcase performance over a 20km link.
Live technical talks (Tech Talks) include:
TECH TALK #1: Utilizing MACOM's 64 GBaud Flip-Chip ICs for 400ZR Applications. This presentation highlights MACOM’s 64 GBaud flip-chip driver and TIA ICs targeted for 400ZR applications. As the industry continues to migrate to smaller-form-factor and more tightly packaged coherent modules, the requirement for utilizing flip-chip assembly techniques becomes more prevalent. In this talk, MACOM presents the performance of its quad-channel 64GBaud Driver and TIA, while highlighting the advantages and disadvantages of using these ICs in a flip-chip format.
TECH TALK #2: 50G PAM-4 Transmitter Modelling & Optimization using DMLs. This presentation covers the modelling of a complete transmit data path from MACOM’s PRISM-50D DSP with integrated DML driver, PCB, FPC and DML TO-CAN. Using the model, the impact of the various system elements on an end-to-end link can be understood and refined to achieve targeted transmitter performance. In this talk, measurements of a real system will be used to support the simulation data. MACOM will review key transmitter design considerations using DMLs and how to implement module designs using the PRISM-50D DSP with integrated MACOM DML driver.
TECH TALK #3: Key Considerations for 25 GBaud DML and Drivers. This presentation highlights the electrical performance of MACOM’s 28GBaud DML drivers as well as the optical performance alongside MACOM’s 25G DML. In this talk, MACOM will review the performance of various high-speed drivers, while highlighting key applications-related questions aimed at helping to integrate these drivers into module assemblies.
TECH TALK #4: 100G per Lane Direct Drive: The Path to Lower Power 100G PAM Interfaces. MACOM is presenting the benefits of a 100G Linear architecture for network connectivity applications. This talk will present measurements and simulations highlighting the power and cost reductions enabled with this approach.
To schedule a demo or attend a technical talk, contact MACOM sales, or e-mail demos@macom.com.
