12 December 2022
Indium Corp introduces no-clean, halogen-free solder paste for advanced LEDs
Indium Corp of Clinton, NY, USA (which refines, smelts, manufactures and supplies materials to the global electronics, semiconductor, thin-film and thermal management markets) has expanded its portfolio of proven pastes with a new no-clean, halogen-free solder paste designed for advanced LED applications, including COB, COG, SMT and other varieties of LED.
LEDPaste NC38HF combines what is claimed to be superior wetting performance with excellent stencil print transfer efficiency to satisfy a broad range of process requirements for mini-LED applications. Mini-LEDs typically feature a length of less than 240μm on the component edge. Offering printability down to 60μm apertures, the new material offers compatibility with the current size of mini-LEDs and as future die continue to miniaturize.
LEDPaste NC38HF delivers:
- consistent and tight solder deposit spread across multiple prints and excellent response-to-pause characteristics;
- minimal voiding on tight-pitch components, ensuring joint strength on small components;
- what is claimed to be industry-leading non-wet open (NWO) performance using superior oxidation barrier technology, enabling reduced solder ball and solder beading defects and enhanced graping performance;
- enhanced slump performance with minimal bridging during the assembly process, improving yields for tight-pitch components.
A proven product, LEDPaste NC38HF was recognized with an award for Excellent Product of the Year at the MiniLED conference in Shenzhen, China on 10 November.