AES Semigas


14 September 2022

MRSI launches MRSI-H1 and MRSI-HVM1 die bonders

MRSI Systems (Mycronic Group) of North Billerica, MA, USA (which makes fully automated, high-precision, high-speed, flexible eutectic and epoxy die bonding systems) has launched the MRSI-H1 and MRSI-HVM1 die bonders with 1µm machine accuracy (to be available in the fourth-quarter 2022).

The MRSI-H1 and MRSI-HVM1 have been developed from the MRSI-H/MRSI-HVM platforms, further improving accuracy to the 1µm level and providing suitable solutions for increasingly demanding applications such as the mass manufacturing of silicon photonics and light detection & ranging (LiDAR). MRSI says that its die bonding solutions help customers to enable just-in-time supply and fast-pace innovations of critical components for high-growth market segments. 

MRSI adds that the new products inherit the firm’s tradition of combining accuracy, speed and flexibility to reduce NPI cost, improve production agility and hence increase return-of-investment for customers. They also come with MRSI’s long proven product reliability and global customer support. 

See related items:

MRSI and Lumentum collaborate on developing automotive LiDAR solutions

Tags: Die Bonder


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