AES Semigas


22 September 2022

onsemi expands Czech silicon carbide wafer and epi fab

Power semiconductor IC supplier onsemi of Phoenix, AZ, USA has inaugurated its expanded silicon carbide (SiC) fab in Rožnov, Czech Republic with a ribbon-cutting ceremony led by Ministry of Industry and Trade section chief Zbyněk Pokorný, Governor of the Zlín Region Radim Holiš and City Mayor Jiří Pavlica as well as other local governmental dignitaries.

Ribbon-cutting ceremony for the expansion of onsemi’s Rožnov silicon carbide fab.

Picture: Ribbon-cutting ceremony for the expansion of onsemi’s Rožnov silicon carbide fab.

Starting in 2019, onsemi added SiC polished wafer and SiC epitaxy wafer production to its existing silicon polished and epitaxy wafer and die manufacturing in Rožnov. Having outgrown the original site, construction of a new building began in 2021 to further expand wafer and SiC epi manufacturing. Over the next two years, this expansion will increase the site’s SiC production capabilities by 16 times and create 200 jobs by the end of 2024. So far onsemi has invested more than $150m in the Rožnov site and plans to spend an additional $300m through 2023. onsemi was recently awarded the Association for Foreign Investments (AFI) Prize for Significant Contribution in the Field of Investment for its SiC investments in the Czech Republic.

“Together with our SiC boule production expansion in Hudson, NH, these increased SiC manufacturing capabilities enable onsemi to provide customers the critical supply assurance to meet the rapidly growing demand for SiC-based solutions,” says Simon Keeton, executive VP & general manager Power Solutions Group at onsemi. “Full control over our SiC manufacturing supply chain and the market-leading efficiency of our products underscore onsemi’s progress.”

See related items:

onsemi expands silicon carbide production facility in New Hampshire

onsemi Roznov wins Zlín Region manufacturing innovation award

onsemi completes acquisition of GTAT

Tags: SiC


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