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29 September 2022

onsemi launches automotive SiC-based power modules for on-board chargers

Power semiconductor IC supplier onsemi of Phoenix, AZ, USA has announced a trio of silicon carbide (SiC)-based power modules in transfer-molded technology for use in on-board charging and high-voltage (HV) DC-DC conversion in all types of electric vehicles (xEV). The APM32 series is reckoned to be the first-of-its-kind that adopts SiC technology into a transfer-molded package to enhance efficiency and shorten charge time of xEVs and is specifically designed for high-power 11-22kW on-board chargers (OBC).

Each of the three modules exhibits low conduction and switching losses, combining with best-in-class thermal resistance and high voltage isolation to deal with 800V bus voltage. The enhanced efficiency and lower heat generation ultimately allow for a more powerful OBC that can charge the xEV faster and increase its operating range (two critical factors for consumers).

“Our new modules employ the latest SiC technology to minimize losses and overall system volume, allowing designers to meet charging efficiency and space goals,” says Fabio Necco, VP & general manager Automotive Power Solutions at onsemi. “By adopting the pre-configured modular format, designers are able to configure their designs faster, with significantly lower time-to-market and design risk.”

Taking advantage of onsemi’s end-to-end SiC supply chain capability and proven SiC MOSFETs and diodes, the APM32 modules offer high levels of reliability, and each module is serialized for full traceability. The modules can operate with junction temperatures (Tj) as high as 175°C, ensuring reliability even in challenging, space-constrained automotive applications.

“APM32 provides a differentiated solution for our customers by leveraging onsemi’s best-in-class packaging to unleash the full capability of the leading-edge silicon carbide technology,” says Simon Keeton, executive VP & general manager, Power Solutions Group. “In addition, we know our customers value supply assurance, which our end-to-end SiC supply chain capabilities provide.”

Two modules of the APM32 series, NVXK2TR40WXT and NVXK2TR80WDT, are configured in H-bridge topology with a breakdown (V(BR)DSS) capability of 1200V (ensuring suitability for high-voltage battery stacks) for use in the OBC and HV DC-DC conversion stages. The third module, NVXK2KR80WDT, is configured in Vienna rectifier topology for use in the power factor correction (PFC) stage of the OBC. There will be six-pack and full-bridge modules in the near future to complete the SiC OBC portfolio.

All three modules are housed in a compact and robust dual inline package (DIP), ensuring low module resistance. The top cool and isolated features meet the most stringent automotive industry standards. The creepage and clearance distances meet IEC 60664-1 and IEC 60950-1. Additionally, the modules are qualified to AEC-Q101 and AQG 324 for automotive use.

See related items:

EV car maker NIO selects onsemi’s silicon carbide traction power modules

Tags: SiC

Visit: www.onsemi.com

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