15 September 2022
POET participating in multiple sessions at ECOC 2022
POET Technologies Inc of Toronto, Ontario, Canada — a designer and developer of the POET Optical Interposer and photonic integrated circuits (PICs) for the data-center and telecom markets — says that representatives from the firm will participate at the European Conference on Optical Communication (ECOC 2022) in Basel, Switzerland (18–22 September), while the company is also exhibiting in booth 578.
On 22 September in the session ‘Non-Linear Devices and Packaging’ at 10:45am CEST, principal engineer Dr Simon Goh is presenting a paper on the passive alignment of lasers on the POET Optical Interposer.
A concurrent symposium ‘Hybrid Integration of III-V Devices with Silicon-based Waveguides (Si, SiN, SiO2)’ is co-organized by POET technical staff member Dr Lucas Soldano. Chairman & CEO Dr Suresh Venkatesan is also a participating speaker.
Additionally, on 20 September (at 2pm CEST) Dr Michal Lipson, professor of physics at Columbia University and a nominee to POET’s board of directors, is leading a tutorial ‘The State of the Art and Challenges of Silicon Photonics Today’.
“Hybrid Integration is one of the critical and important topics of discussion among professionals in the photonics industry today,” says Venkatesan. “It is widely understood that neither conventional discrete assembly nor conventional silicon photonic integrated circuits (PICs) are up to the challenges of scalability in volume, cost and power consumption that are required for increasing speeds and bandwidth in data and telecommunications, much less the high-volume applications for photonics in optical computing, wearables and automotive LiDAR [light detection & ranging],” he adds. “We recognized these challenges years ago, which is why the POET Optical Interposer is the only true hybrid wafer-level, chip-scale platform that integrates electronic and photonic devices in a fully CMOS-compatible assembly process that meet these challenges and is available today to companies that need integration solutions.”