AES Semigas


26 April 2023

Infineon and Schweizer extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions

Infineon Technologies AG of Munich, Germany and Schweizer Electronic AG of Schramberg, Germany are collaborating on ways to further increase the efficiency of chips based on silicon carbide (SiC) by developing a solution to embed Infineon’s 1200V CoolSiC chips directly onto printed circuit boards (PCB), which will increase the range of electric vehicles and reduce the total system costs.

The two firms have already demonstrated the potential of this new approach by embedding a 48V MOSFET in the PCB. This resulted in a 35% increase in performance. Schweizer contributes to this with its p2Pack solution, which enables power semiconductors to be embedded in PCBs.

Infineon and Schweizer are showcasing 1200V CoolSiC chip embedding technology at PCIM Europe.

Picture: Infineon and Schweizer are showcasing 1200V CoolSiC chip embedding technology at PCIM Europe.

“Our joint goal is to take automotive power electronics to the next level,” says Robert Hermann, product line head Automotive High-Voltage Discretes and Chips, at Infineon. “The low-inductive environment of a PCB allows clean and fast switching. Combined with the leading performance of 1200V CoolSiC devices, chip embedding enables highly integrated and efficient inverters that reduce overall system costs,” he adds.

“With Infineon’s 100% electrically tested standard cells (S-Cell), we can achieve high overall yields in the p2Pack manufacturing process,” comments Thomas Gottwald, VP technology at Schweizer. “The fast-switching characteristics of the CoolSiC chips are optimally supported by the low-inductance interconnection that can be achieved with the p2Pack. This leads to increased efficiency and improved reliability of power conversion units such as traction inverters, DC–DC converters, or on-board chargers.”

Infineon and Schweizer are showcasing the 1200V CoolSiC chip embedding technology at the Power, Control and Intelligent Motion (PCIM) Europe 2023 trade fair in Nuremberg, Germany (9–11 May), at the Infineon booth 412 in Hall 7. Schweizer is also exhibiting, at booth 410 in Hall 6.

Tags: Infineon



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