24 January 2023
Oxford Instruments receives tier-1 orders for InP high-volume manufacturing equipment
To support demand from high-growth markets such as communications and sensors, indium phosphide (InP) processing capability is becoming more advanced, with a higher degree of automation, while the industry is also looking to migrate to 6”-diameter wafers to increase the number of die per wafer. UK-based Oxford Instruments says that it is enabling this transition by utilizing its high-temperature electrostatic clamping (Hot ESC) for the PlasmaPro 100 Cobra ICP etch module, which is part of its range of ICP InP etch processing solutions. The Hot ESC capability from 75mm wafer size upwards is a full automation-compatible solution, which reduces manual processing for increased reliability and repeatability (critical at larger wafer sizes and with more complex processes).
Oxford Instruments says that its development of leading-edge processes, supported by next-generation hardware, has been recognised by the receipt of orders from tier-1 customers. The solution is in high demand and is ready to enable automated processing and larger wafer sizes. The orders from leading European and Asian optical module and integrated device manufacturers (IDMs) are supported by excellent InP market growth projections and the expansion of manufacturing capacity to meet anticipated demand. Datacom and telecom are, and will continue to be, the two biggest segments of the market, but consumer and wearable sensors will also contribute to a compound annual growth rate (CAGR) of 14% in InP photonics market revenue, forecasts market analyst firm Yole.
Oxford Instruments is attending the Photonics West 2023 event in San Francisco (28 January–2 February), where its experts will share the latest advances in optoelectronics, photonics, laser and quantum technology.