2 March 2023
Sivers Photonics to demo CW-WDM MSA-compliant DFB laser arrays at OFC
IC and integrated module supplier Sivers Semiconductors AB of Kista, Sweden says that its subsidiary Sivers Photonics of Glasgow, Scotland, UK is to exhibit and give a live demonstration of its CW-WDM MSA-compliant 8-wavelength O-band DFB laser arrays on 7–9 March in booth #5400 at the Optical Fiber Communication Conference and Exhibition (OFC 2023) in San Diego, CA, USA. Sivers says that the laser technology is enabling integrated photonics to support the growing demand for improved internet services at lower power consumption and reduced costs.
Following a successful demo at last September’s European Conference on Optical Communication (ECOC 2022), Sivers Photonics is once again partnering with silicon photonics-based chip-to-chip optical connectivity firm Ayar Labs of Santa Clara, CA, USA (which is exhibiting in booth #6008), demonstrating the 8-wavelength DFB laser array integrated into Ayar Labs’ SuperNova multi-wavelength optical source. This technology is driving advanced ultra-high-speed optical interconnects for use in next-generation applications, including co-packaged optics (CPO), high-performance computing (HPC) and artificial intelligence (AI).
“This ongoing partnership is crucial for driving leading-edge, ultra-high-speed optical interconnect solutions for next-generation applications,” says Sivers Photonics’ managing director Billy McLaughlin.
“Demonstrating our 8-wavelength DFB laser arrays at OFC allows us to showcase how far we have come with our DFB technology,” says Sivers Semiconductors’ group CEO Anders Storm. “Our indium phosphide (InP) lasers are showing world-class performance, underpinned by our great partner Ayar Labs using our DFBs to show their one-of-a- kind solution with their SuperNova light source in combination with the TeraPHY optical I/O chiplet,” he adds.
Sivers is also showcasing the ongoing work with its partners imec and ASMPT on high-precision III-V laser flip-chip assembly for silicon photonics. Flip-chip-bonded DFB lasers/RSOAs from Sivers’ InP100 product platform, with precision bonding from partner ASMPT, allow imec to extend the capability of its iSiPP silicon photonics platform with validated interfaces for hybrid laser integration, accelerating the adoption of silicon photonics at scale.