AES Semigas


8 May 2023

Infineon adds CoolSiC power modules using 3.3kV MOSFETs in XHP 2 package, targeting traction applications

To meet global climate targets, transportation must shift to more environmentally friendly vehicles such as energy-efficient electrified trains. However, trains have demanding operating profiles with frequent acceleration and braking, while being expected to operate reliably over a long service life. Consequently, energy-efficient traction applications with high-power density, reliability and quality are required for implementation. Infineon Technologies AG of Munich, Germany says that it is addressing these requirements by adding two new products to its CoolSiC power module portfolio.

The FF2000UXTR33T2M1 and FF2600UXTR33T2M1 power modules use newly developed 3.3kV CoolSiC MOSFETs and Infineon’s .XT interconnection technology. The modules come in XHP 2 package and have been specifically tailored for traction applications.

Infineon’s CoolSiC XHP 2 3.3kV high-power module.

Picture: Infineon’s CoolSiC XHP 2 3.3kV high-power module.

Designed for demanding applications such as traction, the devices are being presented in booth #412 (Hall 7) at the Power, Control and Intelligent Motion (PCIM) Europe 2023 trade show in Nuremberg, Germany (9–11 May). “For environmentally friendly mobility, rail technology requires innovative semiconductor solutions designed specifically for these applications,” says Dr Peter Wawer, division president of Infineon’s Green Industrial Power Division. “With low switching losses and the ability to enable higher switching frequencies, Infineon’s new silicon carbide products contribute to greener and quieter trains, which are extremely important features for tomorrow’s train traffic.”

In addition to an efficient and robust silicon carbide (SiC) chip, power modules for traction drives require packaging that allow fast switching, along with interconnection technologies that enable a long service life time. Infineon says that its new power modules offer such features: the CoolSiC MOSFET chips with integrated body diodes in Infineon's XHP 2 packaging enable low switching losses while maintaining high reliability and power density.

The XHP 2 packaging also features low stray inductance, a symmetrical and scalable design, and high current-carrying capability. The FF2000UXTR33T2M1 module offers a drain–source on-state resistance of 2.0mΩ, while the FF2600UXTR33T2M1 features a drain–source on-state resistance of 2.6mΩ. Despite the demanding operating profiles of trains, Infineon’s .XT interconnect technology improves power cycling capabilities.

Compared with conventional solutions, CoolSiC power modules enable overall energy consumption in the motor and converter of the train to be reduced by 10%, Infineon reckons. Additionally, train operators benefit from a more compact, lighter converter, along with a simplified cooling systems. While this is paying into the decarbonization efforts of Infineon, traction manufacturers and railway service operators, citizens also benefit from lower noise levels when trains go through a neighbourhood, says the firm. A SiC-based XHP 2 power module has been proven in a joint field test with streetcars conducted by Siemens Mobility and Stadtwerke München (SWM) in 2022. The test has shown that power semiconductors based on SiC significantly reduce engine noise during operation.

The CoolSiC XHP 2 3.3kV high-power modules are available as samples for selected customers.

See related items:

Infineon launches XHP 2 CoolSiC power module for streetcars

Tags: Infineon SiC MOSFET



Book This Space