AES Semigas


16 November 2023

imec and SMART Photonics sign MoU to work on hybrid integration of InP on SiN/SiPh

Nanoelectronics research center imec of Leuven, Belgium and independent pure-play indium phosphide (InP) photonic integrated circuit (PIC) foundry SMART Photonics of Eindhoven, The Netherlands have signed a memorandum of understanding (MOU) to underpin their intention to work together in the field of hybrid integration of InP on silicon nitride/silicon photonics (SiN/SiPh).

The collaborative work will include topics such as:

  • hybrid integration of InP on SiN/SiPh with flip-chip bonding and butt coupling;
  • hybrid integration of InP on SiN/SiPh with micro-transfer printing;
  • component design, i.e. laser design and design of interface elements for the integration of InP/SiPh along with system demonstration and prototyping.

Through the cooperation, imec and SMART Photonics aim to accelerate the adoption and market pull of hybrid integrated solutions for domains such as datacoms, automotive, agrifood and health applications.

See related items:

SMART Photonics secures €100m in extra funding round

Tags: PIC InP SiN Silicon photonics



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