News: Microelectronics
26 October 2023
ST launches 32-pin, dual-inline, molded, through-hole package silicon carbide power modules
STMicroelectronics of Geneva, Switzerland has released the ACEPACK DMT-32 family of silicon carbide (SiC) power modules in a 32-pin, dual-inline, molded, through-hole package for automotive applications. Targeted at systems such as on-board chargers (OBC), DC/DC converters, fluid pumps and air conditioning, they are said to deliver advantages including high power density, very compact design, and simplified assembly. ST says that the product family enhances flexibility for system designers by presenting a choice of four-pack, six-pack and totem-pole configurations.
The modules contain 1200V SiC power switches that leverage ST’s second- and third-generation SiC MOSFET technology, ensuring low RDS(on) values. The devices deliver efficient switching performance with minimal dependence on temperature to ensure high efficiency and reliability at converter system level.
Leveraging ST’s proven, robust ACEPACK (Adaptable Compact Easier PACKage) technology, the modules reduce overall system- and design-development costs while ensuring reliability. The package technology features a high-performance aluminium nitride (AlN) insulated substrate for what is claimed to be excellent thermal performance. There is also an integrated NTC sensor that provides temperature monitoring for thermal protection.
The first product in ACEPACK DMT-32, introduced now with ramp-up to volume production from fourth-quarter 2023, is M1F45M12W2-1LA. The M1F80M12W2-1LA, M1TP80M12W2-2LA, M1P45M12W2-1LA, M1P80M12W2-1LA, M1P30M12W3-1LA are sampling now with ramp-up to volume production from first-quarter 2024. Pricing is dependent on configuration.
