News: Optoelectronics
21 August 2024
Mitsubishi Electric to ship samples of 200Gbps PIN-PD chip for 800Gbps and 1.6Tbps fiber communication
Tokyo-based Mitsubishi Electric Corp says that on 1 October it will begin shipping samples of its new 200Gbps PIN-photodiode (PD) chip for use in next-generation optical transceivers to support 800Gbps and 1.6Tbps fiber communication.
The addition of the new PD7CP47 receiver chip to Mitsubishi Electric’s optical device lineup will enable existing devices capable of transmitting at 800Gbps/1.6Tbps to now receive optical data at these same speeds, expanding the communication capacity of optical transceivers, including for high-speed, high-capacity communication in data centers.
Picture: Mitsubishi Electric’s 200Gbps PIN-PD chip for 800Gbps and 1.6Tbps optical-fiber communication.
The introduction of the 200Gbps PIN-PD chip for optical reception follows Mitsubishi Electric’s launch of a mass-produced chip for optical transmission, the 200Gbps (112Gbaud four-level pulse-amplitude modulation [PAM4]) electro-absorption modulator laser diode (EML), in April. Leveraging the firm’s expertise in optical devices, the new PD chip was developed for high-speed, high-capacity data-center communications by integrating backside illumination and a light-accumulating convex lens that minimizes the photoelectric conversion area within the chip structure, resulting in low capacitance to enable high-speed 200Gbps transmission (112Gbaud PAM4), twice that of conventional mainstream products (100Gbps).
