News: Suppliers
21 February 2024
Aehr receives $23m in new follow-on orders
Semiconductor production test and reliability qualification equipment supplier Aehr Test Systems of Fremont, CA, USA has received new follow-on orders totaling $23m from existing customers for FOX wafer-level test & burn-in products to be used for production and engineering qualification needs for wafer-level burn-in and screening of their silicon carbide devices. Customer-requested shipping dates for these orders range from immediate shipment through the end of Aehr’s current fiscal year, which ends on 31 May.
The orders include a significant number of FOX WaferPak full-wafer Contactors for both existing design capacity increases as well as new device designs that are expected to drive additional orders in calendar-year 2024 and beyond.
FOX WaferPak Contactors are used in conjunction with the firm’s FOX-NP and FOX-XP wafer-level test & burn-in systems to contact 100% of the die on a wafer up to several thousand devices at a time. These proprietary WaferPak designs are specific to a customer’s application as well as die layout and unique electrical contact pads. Aehr’s FOX systems and WaferPaks are currently being used on wafer diameters of 4”, 6”, 8” and 12” and can be configured for a wide range of device applications.
“Our proprietary WaferPak Contactors are unique to each end-customer's device design and grow with the number of device designs and capacity needed for volume production of those devices,” notes president & CEO Gayn Erickson. “As we have stated in the past, we are able to quickly ship a large quantity of WaferPaks with very short lead-times with our increased design resources, optimized supply chain, and manufacturing and test processes,” he adds. “We continue to believe our WaferPak business will grow in absolute revenue and also as a percent of the overall revenue for the company. In addition, we have increased our material availability and manufacturing capacity to shorten lead-times on our FOX-NP and FOX-XP test & burn-in systems and automated FOX WaferPak Aligners.”
The FOX-XP and FOX-NP systems and proprietary WaferPaks are capable of functional test & burn-in/cycling of silicon carbide and gallium nitride power semiconductors, silicon photonics integrated circuits as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor before they are assembled into single- or multi-die stacked packages, or in singulated die or module form factor.
Aehr almost doubles revenue year-on-year
New customer orders Aehr FOX-NP multi-wafer test and burn-in system for silicon carbide MOSFETs
