AES Semigas


18 January 2024

Revasum Inc and Asahi Diamond America collaborate on silicon carbide wafer grinding

Semiconductor manufacturing equipment maker Revasum Inc of San Luis Obispo, CA, USA and Asahi Diamond America Inc, a provider of diamond and cubic boron nitride tools, have announced a strategic collaboration aimed at enhancing silicon carbide (SiC) wafer grinding.

Bringing together Revasum’s expertise in semiconductor grinding and Asahi Diamond America’s abrasive technology, the collaboration focuses on the utilization of Revasum’s 7AF-HMG Silicon Carbide Grinder, which is specifically designed for the unique challenges posed by 150mm and 200mm SiC wafers.

The 7AF-HMG is distinguished by its hard-material-optimized grind engine, which quickly and precisely thins and planarizes 150mm and 200mm SiC wafers. Its advanced features and precision are said to enable highly efficient and productive processing of bare substrates and device wafers at customer facilities.

“The 7AF-HMG Silicon Carbide Grinder is a groundbreaking solution that addresses the unique challenges of silicon carbide wafers, and this cooperation will propel the industry forward by improving efficiency and performance,” reckons Revasum’s CEO Scott Jewler.

“Our cutting-edge grind wheels combined with Revasum’s advanced tools will empower semiconductor manufacturers to achieve unprecedented precision and efficiency in silicon carbide wafer processing,” believes Asahi Diamond America’s president Koichi ‘Ken’ Kikuchi.

Tags: SiC substrates




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