News: Microelectronics
29 July 2024
VisIC partners with Heraeus and PINK to deliver high-power-density BEV power modules
VisIC Technologies Ltd of Ness Ziona, Israel – a fabless supplier of power conversion devices based on gallium nitride (GaN) transistors – has partnered with electronic device assembly & packaging materials maker Heraeus Electronics (part of Heraeus Group of Hanau, Germany) and vacuum soldering and sintering system maker PINK GmbH Thermosysteme of Wertheim, Germany to develop an power module utilizing D3GaN technology.
The collaboration brings together VisIC’s expertise in GaN-based devices, Heraeus Electronics’ packaging materials know-how, and PINK's sintering technology.
The integration of VisIC’s D3GaN technology with Heraeus Electronics’ sintering paste and PINK’s Ag and Cu sintering process and flexible sintering equipment is reckoned to set a new benchmark for power module performance in the EV market. This is expected to drive the adoption of GaN technology in electric vehicles (EV) applications.
The module is based on a silicon nitride (Si3N4) metal ceramic substrate, a silver (Ag) sintering process and top-side interconnect, promising high reliability and performance for battery electric vehicles (BEVs).
Si3N4 is known for its excellent thermal conductivity, mechanical strength and reliability under high-temperature conditions. These properties are crucial for the demanding environment of EV applications, ensuring that the power module can withstand the rigors of everyday use while maintaining optimal performance.
The adoption of the silver sintering process by PINK enhances the thermal and electrical conductivity of the module. Silver sintering is a low-temperature bonding process that creates robust and reliable connections between components, improving the module's overall durability and efficiency. This process is critical for the high reliability required in EV powertrains, where consistent performance is non-negotiable.
Designed to meet the stringent reliability and performance standards of the EV industry, the resulting power module can deliver the high power density of over 500Arms/650V and efficiency needed for modern BEVs while also offering long-term reliability and durability at a cost point near silicon devices.
