News: Microelectronics
26 June 2024
IEEE’s 2nd Wide Bandgap Power Devices in Europe conference being held in South Wales
The Institute of Electrical and Electronics Engineers (IEEE) is hosting its second bi-annual Power Electronics and Wide Bandgap Power Devices and Applications (WiPDA-Europe 2024) conference at the Royal Welsh College of Music and Drama in Cardiff City Centre, Wales, UK (16-18 September).
Hosted alongside Cardiff University and Compound Semiconductor Applications (CSA) Catapult, the conference provides an opportunity for scientists, designers and engineers to share their latest insights and developments in wide-bandgap power devices and applications.
Prior to the conference, there is an opportunity for researchers to submit papers to the IEEE focused on topics ranging from wide-bandgap system design to device structures and fabrication techniques. A selection of the papers submitted will be showcased at the conference in September.
Attendees at WiPDA-Europe can engage with the latest wide-bandgap technology and innovations and participate in technical sessions, tutorials and keynote presentations.
Attendees are also invited to a private tour of Cardiff University as well as CSA Catapult’s Innovation Centre in Newport.
As the UK’s leading authority on compound semiconductor applications and commercialization, CSA Catapult specializes in power electronics, photonics, advanced packaging, and radio-frequency (RF) and microwave communications technologies.
Wide-bandgap technology suits power electronics applications such as electric vehicles due to its capabilities at high power and high operating temperatures.
“I am delighted to support the WiPDA-Europe 2024 workshop as general co-chair and look forward to the event featuring tutorials, keynotes, presentations and a poster session, as well as an evening reception, a gala dinner and a tour of the Cardiff University Translational Research Hub and Compound Semiconductor Applications Catapult,” says Ingo Ludtke, head of power electronics at CSA Catapult.
