News: Microelectronics
19 June 2024
Qorvo adds RF multi-chip modules for advanced radar applications
Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. The new modules leverage Qorvo’s packaging and process technology to deliver the compact size and what is claimed to be the superior performance, lower noise and reduced power consumption needed for modern phased-array and multi-function radar systems.
Doug Bostrom, general manager of Qorvo’s Defense & Aerospace business, said, “These new multi-chip modules combine several functions into one package, reducing board area, boosting performance and streamlining both design and assembly for our customers. This approach underscores our commitment to innovation and customer success by helping accelerate their time-to-market. Complemented by our recent acquisition of Anokiwave and associated beam-former technology, Qorvo is well positioned to provide complete solutions for phased-array radar applications.”
Key features and benefits:
- QPF5001 12W X-band front-end module (FEM): Combines a power amplifier, low-noise amplifier (LNA) and limiter in one compact module, reducing the board area by about 50% compared with discrete component solutions;
- QPM2101 S-band receive variable-gain amplifier (VGA) MCM: Integrates an LNA, 6-bit digital step attenuator, Rx buffer and T/R switch, delivering a 40% reduction in board area;
- QPB1029 L-band filter bank MCM: Integrates two switches on both sides of eight filters and a bypass. Housed in a 10mm x 10mm package, it is said to be the industry’s smallest L-band radar eight-channel switched filter bank, enabling radar designers to achieve size, weight, power and cost (SWaP-C) goals.
Qorvo is exhibiting in booth 1125 at the 2024 IEEE MTT-S International Microwave Symposium (IMS) in Washington DC (16–21 June).
