News: Optoelectronics
15 March 2024
Infinera launches 1.6Tb/s optics to reduce power per bit by up to 75% for AI-driven intra-data-center connectivity
Infinera Corp of San Jose, CA, USA — a vertically integrated manufacturer of digital optical network systems — has announced ICE-D, a new line of high-speed intra-data-center optics based on monolithic indium phosphide (InP) photonic integrated circuit (PIC) technology. ICE-D optics are designed to dramatically lower cost and power per bit while providing intra-data-center connectivity at speeds of 1.6 terabits per second (Tb/s) and greater. The technology enables data-center operators to cost-effectively keep pace with relentless growth in bandwidth, says Infinera.
Driven by artificial intelligence (AI) workloads and switched network applications, market demand for high-speed (800G+), intermediate-reach (100+ meters) intra-data-center interconnect technology is projected to grow nearly tenfold over the next four years — from about 300,000 units in 2023 to more than 2.5 million units by 2027, with a total market opportunity of greater than $2.2bn, according to industry analysts at Cignal AI.
“Intra-data-center bandwidth is growing at an unprecedented rate as artificial intelligence applications transform connectivity demands between processing devices,” says Scott Wilkinson, lead analyst, Networking Components at Cignal AI. “This global trend will require innovative high-speed, low-latency and power-efficient solutions to enable data-center operators to economically meet the challenge of scaling intra-data-center connectivity — today and well into the future.”
Leveraging the unique capabilities of its US-based optical semiconductor fab, Infinera’s intra-data-center optical connectivity technology enables highly integrated solutions that combine multiple optical functions onto a single monolithic chip, resulting in what is claimed to be industry-leading density, low latency, and power efficiency. ICE-D test chips are currently available and have demonstrated a reduction in power per bit by as much as 75% while simultaneously increasing connectivity speed.
“Infinera is excited to apply our 20+ years of pioneering innovation in optical connectivity solutions to solve the challenge of economically scaling intra-data-center connectivity to support the deluge of bandwidth stemming from AI applications,” says Ron Johnson, senior VP & general manager of Optical Systems and Global Engineering at Infinera. “Our unique monolithic InP PIC technology puts us in an ideal position to develop innovative technologies to provide cost- and power-efficient, high-capacity intra-data-center connectivity solutions,” he adds.
Infinera’s flexible ICE-D intra-data-center optics are designed to support integration into a variety of different intra- and campus data-center optical solutions. These include digital signal processor (DSP)-based re-timed optics, linear-drive pluggable optics (LPO), and co-packaged optics (CPO) for both serial and parallel fiber applications and distances ranging from 100m up to 10km.
Infinera is showcasing its ICE-D intra-data-center optics and comprehensive portfolio of open optical networking solutions in booth 2825 in the Exhibit Hall at the Optical Fiber Communication Conference & Exposition (OFC 2024) in San Diego, CA, USA (26–28 March).
