News: Suppliers
28 May 2024
EVG highlights heterogeneous integration technologies at ECTC
EV Group of St Florian, Austria – a supplier of wafer bonding and lithography equipment for semiconductor, micro-electro-mechanical systems (MEMS) and nanotechnology applications – says that new developments in heterogeneous integration enabled by its wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding, lithography and infrared (IR) laser release solutions are being highlighted in papers presented at the 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) at The Gaylord Rockies Resort & Convention Center in Denver, CO, USA (28-31 May), where EVG is also exhibiting in booth 522.
This year, EVG has a record seven papers and three posters in the ECTC technical program:
- ‘0.5 μm Pitch Wafer-to-Wafer Hybrid Bonding at Low Temperatures With SiCN Bond Layer’ (Session 8, Sub-Micron Scaling in Wafer-to-Wafer Hybrid Bonding – 29 May, 4:25pm) – co-authored with Applied Materials;
- ‘IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism’ (Session 9, Advanced Processes for Chip Stacking – 29 May, 2pm) – co-authored with imec;
- ‘Investigation of Distortion in Wafer-to-Wafer Bonding With Highly Bowed Wafers’ (Session 10, Novel 3D Integration and Hybrid Bonding Solutions – 29 May, 2pm) – co-authored with imec;
- ‘Moving Towards Microchannel-Based Chip Cooling’ (Session 10, Novel 3D Integration and Hybrid Bonding Solutions – 29 May, 4:05pm) – co-authored with SEMI, SPTS Technologies, Meta Platforms, Taiwan Semiconductor Manufacturing Company (TSMC), HP, Google and Advanced Semiconductor Engineering (ASE);
- ‘Novel Inorganic IR Release Process for High Temperature W2W and D2W Integration’ (Session 10, Novel 3D Integration and Hybrid Bonding Solutions – 29 May, 4:25pm);
- ‘Development of UV-Curable Molding Materials With Minimum Die-Shift for FOWLP/FOPLP’ (Session 21: Innovations in Polymer Packaging Materials – 30 May, 2:20pm) – co-authored with DELO Industrial Adhesives;
- ‘Ultra High Density RDL Patterning of High-Resolution Dielectrics by Maskless Exposure Technology for High Performance Computing and Artificial Intelligence’ (Session 33: Fine-Pitch Materials and Processes – 31 May, 3:45pm) – co-authored with Fujifilm Electronic Materials and Fujifilm Electronic Materials Europe;
- ‘Multiphysics Overlay Modeling of Monolithic 3D Fusion and Hybrid Bonding Processes’ (Session 37: Interactive Presentations – 29 May, 10am–12pm);
- ‘300 nm Pitch W2W HBI for CFET and 3D DRAM Through Module Co-Optimization’ (Session 40: Interactive Presentations – 30 May, 2:30–4:30pm) – co-authored with Applied Materials;
- ‘Investigation on the Use of Al-Ge Eutectic Bonding in the Structural Part of a Multilayer Stacked MEMS Device’ (Session 40: Interactive Presentations – 30 May, 2:30–4:30pm) – co-authored with imec.
EVG heterogeneous integration solutions
EVG’s wafer bonding, lithography and metrology solutions enable the development and high-volume manufacturing of technology innovations in advanced packaging — including backside-illuminated CMOS image sensors and other 3D-IC stacked devices—as well as in MEMS and compound semiconductors. Recent breakthroughs in hybrid bonding to address the needs for 3D device integration, wafer bond alignment technology to address future 3D-IC packaging requirements, IR laser release technology to eliminate glass substrates for advanced packaging and enable thin-layer 3D stacking, maskless exposure for Fan-out wafer-level packaging (FOWLP), and nanoimprint lithography (NIL) to support wafer-level optics (WLO) manufacturing, are a few examples of EVG’s technology for heterogeneous integration and wafer-level packaging.
EVG also engages with companies and research groups across the technology supply chain to develop high-volume manufacturing solutions that drive new innovations in semiconductors, sensors and photonics for a wide variety of automotive, medical, industrial and home entertainment applications.
EVG completes construction of Manufacturing V building
