News: LEDs
9 May 2024
Marktech unveils multi-chip packages with InGaAs photodiodes and multiple LED emitters
Marktech Optoelectronics Inc of Latham, NY, USA, a designer and manufacturer of optoelectronics components and assemblies — including UV, visible, near-infrared (NIR) and short-wave infrared (SWIR) emitters, detectors, and indium phosphide (InP) epiwafers — has unveiled its new multi-chip packages with indium gallium arsenide (InGaAs) photodiodes and multiple LED emitters.
Picture: SWIR multi-chip emitter-detector with multiple wavelength LEDs (1040nm, 1200nm, 1300nm, 1460nm, 1550nm) and a 600–1700nm sensitivity InGaAs photodiode.
Marktech says that its visible, NIR and SWIR emitters combined with its IR detectors (InGaAs photodiodes) are suitable for many analytical, medical, aerospace and industrial sensing applications. Specifically, multiple LED light sources and the appropriate photodiode detector can allow improved signal-to-noise ratio and detection speed in spectrometry, fluorescence microscopy, and other optical analytical methods.
NIR and especially SWIR wavelength light can penetrate deeper into human tissue than visible light due to the reduced photon scattering at these wavelengths, enabling the capture of deep tissue chemical composition information. Marktech’s MTMD142345PDT38 multiple SWIR wavelength emitter-detector span 1040nm, 1200nm, 1300nm, 1460nm and 1550nm peak wavelength LEDs combined with the firm’s InGaAs photodiode for SWIR detection in the 600–1750nm range, suiting infrared spectroscopy.
Also, a silicon detector can be added to the package when UV and visible LED light needs to be monitored or detected. Marktech can even co-package silicon carbide (SiC) photodiodes with 235nm or 255nm LEDs for deep UVC applications where solar blindness is required.
The co-packaged emitters are individually addressable. Multiple chip products are available in TO can and hermetic SMD packages.
The firm says that the new LED light sources, multiple wavelength LED emitters, have several advantages over singular packaged LEDs and older, conventional light sources, including:
- rapid variation of light power output and wavelength;
- reduced part count, circuitry and design complexity;
- more compact designs for wearables;
- reduced power and heat and improved life-time and response time (no warm-up);
- elimination of moving parts; and
- high emission stability.
The specific combinations of emitters and detectors can be tailored or ‘mixed and matched’ to an application’s specific light source and detection requirements.
“We can assemble virtually any combination of deep UVC to MWIR wavelength LEDs with our InGaAs, silicon, SiC, or other detectors in various packages, demonstrating our adaptability to meet specific OEM design needs,” says chief technology officer Vincent Forte.
