News: Microelectronics
20 May 2024
SemiQ unveiling 1200V half-bridge modules in S3 package at PCIM
In Alfatec’s booth (418, Hall 7) at Power, Control and Intelligent Motion (PCIM) Europe 2024 in Nuremberg, Germany (11–13 June), SemiQ Inc of Lake Forest, CA, USA — which designs, develops and manufactures silicon carbide (SiC) power semiconductors and 150mm SiC epitaxial wafers for high-voltage applications — is showcasing its latest SiC power solutions and its known-good-die (KGD) screening process (launched at the beginning of May).
SemiQ is debuting the latest addition to its QSiC family of high-speed-switching MOSFET half-bridge modules in S3 packages, which offer enhanced design flexibility and performance in current applications. Featuring industry-standard 62mm footprints and 26.3mm high, the new power modules address the size, weight and power demands of challenging applications, ranging from induction heaters, welding equipment and uninterruptible power supplies (UPS) to photovoltaic and wind inverters, energy storage systems, high-voltage DC–DC converters and battery charging systems for electric vehicles (EVs). They are available in 600A (GCMX003A120S3B1-N) and 400A (GCMX005A120S3B1-N) variants. Visitors can also see SemiQ’s QSiC family of 1200V modules in SOT-227, half-bridge and full-bridge options.
Booth attendees can also learn more about the known-good-die (KGD) screening program and see SemiQ’s MOSFET bare die on known-good-die UV tape array for the first time. The KGD process delivers high-quality, electrically sorted and optically inspected advanced SiC MOSFET technology ready for back-end processing and direct die attachment.
“With the expansion of our QSiC family, our goal is to offer a comprehensive, high-performance SiC portfolio across various sectors and offer customized solutions for cutting-edge designs,” says president Dr Timothy Han. “Our continued dedication to rigorous testing and quality assurance, delivering unmatched reliability, is embodied in our new KGD program, which we will be demonstrating at the event.”
