News: Microelectronics
18 November 2024
Microelectronics Commons Hubs gain extra $160m in US CHIPS Act funding
The US Department of Defense (DoD) has invested an additional $160m of funds from the Biden–Harris Administration’s ‘Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act’ to advance US microelectronics capabilities through the Microelectronics Commons, a collaborative national network of technology hubs. Following the award in September of $269m for 33 new technical projects and the award of just under $240m released a year previously to initially launch the eight hubs, the latest funding in October represents a milestone for the CHIPS Act’s mission to strengthen the USA’s global leadership in microelectronics and semiconductor manufacturing.
Focused on building infrastructure, supporting operations, and accelerating workforce development across the eight established hubs, the bulk of the new funding in this latest tranche of $148m will go directly to the Microelectronics Commons Hubs, comprising:
- $18.7m for the Northeast Microelectronics Coalition (NEMC) Hub, led by the Massachusetts Technology Collaborative.
- $16.6m for the Silicon Crossroads Microelectronics Commons (SCMC) Hub, led by the Applied Research Institute in Indiana.
- $27m for the California Defense Ready Electronics and Microdevices Superhub (CA DREAMS) Hub, led by the University of Southern California.
- $23.7m for the Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS) Hub, led by the North Carolina State University.
- $18.7m for the Southwest Advanced Prototyping (SWAP) Hub, led by the Arizona Board of Regents on behalf of Arizona State University.
- $12.3m for the Midwest Microelectronics Consortium (MEMC) Hub in Ohio.
- $10.6m for the Northeast Regional Defense Technology (NORDTECH) Hub, led by the New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES).
- $15.3m for the California–Pacific-Northwest AI Hardware Hub (NWAI), led by the Board of Trustees of the Leland Stanford Junior University in California.
An additional $10m will support a Cross-Hub Enablement Solution (CHES), enhancing shared access to critical electronic design automation (EDA) tools and cloud computing resources. October’s funding also included the latest addition to the Commons prototype project list, a $2m project aligned to the SCMC Hub that came through after final negotiations with project team members.
“America's military systems are the most capable in the world, and that would not be possible without advanced semiconductor technology,” says Dr Arati Prabhakar, assistant to the President for Science and Technology and director of the White House Office of Science and Technology Policy. “Thanks to President Biden and Vice President Harris’ leadership, we're making the semiconductor innovation investments today that will bolster global security tomorrow.”
“Semiconductors are key to the must-win technologies of the future for next generation weapons systems, including artificial intelligence and 5G,” says Dr Dev Shenoy, principal director of microelectronics for the Department of Defense. “These technologies will be essential to achieving the goal of a dynamic, inclusive, and innovative national economy identified as a critical American advantage.”
The Microelectronics Commons network also convened its 2024 Annual Meeting and National Semiconductor Technology Center (NSTC) Symposium from 28-30 October in Washington DC, gathering 1000 in-person attendees and over 1000 virtual participants. Deputy Secretary of Defense Kathleen H. Hicks, who delivered the keynote address, praised the network’s collaborative approach, noting, “Chips bring America together”.
Throughout the event, leaders of the Microelectronics Commons provided updates on their Hubs' progress, discussing first-year achievements, prototype projects, and workforce development initiatives. Discussions underscored the importance of ongoing investments in lab-to-fab pathways – initiatives that streamline the transition from research laboratories to semiconductor fabrication facilities.
“The Microelectronics Commons aims to enable lab-to-fab prototyping, evolving microelectronics laboratory prototyping to fabrication prototyping in domestic facilities,” says Shenoy. “More specifically, the goal is a national network of regional innovation hubs distributed across the US that will foster a pipeline of domestic talent and innovative ideas, reduce barriers to innovation, and mature emerging microelectronics technologies.”
The CHIPS and Science Act and the Microelectronics Commons program represent a monumental investment in the US semiconductor industry. As the Commons network gains momentum, stakeholders are optimistic about America’s potential to lead in an era where advanced microelectronics and resilient supply chains are critical to national security.
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