News: Suppliers
13 November 2024
NexGen Wafer Systems launches SERENO wet etch and clean multi-chamber platform
Singapore-based wet etch and clean solutions provider NexGen Wafer Systems has launched SERENO its latest multi-chamber platform (available now for orders, with first deliveries starting in first-quarter 2025).
SERENO combines high performance with flexibility, offering integrated metrology for precise substrate and layer thickness control, as well as surface roughness control. Its onboard chemical supply system supports multiple process chemicals with integrated mixing, blending and comprehensive analytics, ensuring maximum adaptability across a wide range of applications.
With a compact footprint of less than 12m2 and a throughput of up to 200 wafers per hour, SERENO is designed to deliver efficiency and versatility in wet chemical processes. Tailored for both FEOL and BEOL applications, SERENO addresses increasing demands for higher performance, precision and cost efficiency, positioning it as a future-proof solution for evolving manufacturing requirements.
High performance in a compact design
The SERENO platform is said to offer maximum flexibility regarding wafer-handling capabilities and process control. It supports various substrate types for 6”, 8” and 12” wafers, with bridge tool functionality for multiple wafer sizes. Its versatile handling system supports wafer thicknesses ranging from ultra-thin wafers below 100µm to bonded wafers exceeding 2mm in total thickness. High-performance process chambers combined with innovative chemical dispensing and scanning control offer maximum freedom, leading to what is claimed to be outstanding on-wafer performance.
“With SERENO, we provide wet etch and clean solutions that deliver high throughput in a compact footprint while maximising the flexibility and performance advantages of single-wafer technology,” says chief marketing officer Christian Kleindienst. “Our SERENO platform addresses our customers’ demand for flexible, high-performance single-wafer solutions that reduce operational costs and present a highly attractive alternative to traditional batch tools.”
Features of the SERENO platform
- Advanced Process Control: Customizable wafer scanning and precise fluid dispensing enable optimal process performance across all dimensions.
- Integrated Metrology: Built-in thickness and roughness metrology provide real-time feedback, ensuring process uniformity and quality.
- High-Performance Chambers: Industry-leading liquid flow and exhaust performance ensure reliable cross-contamination-free processing.
- Versatile Chemical Supply: Onboard storage for up to three process chemicals with dual 90-litre tanks ensures uninterrupted processing.
Applications
- Surface clean
- particle removal;
- polymer removal;
- residual removal;
- backside/bevel cleaning;
- incoming wafer cleaning.
- Film and metal etch
- backside/bevel film etch (silicon nitride, silicon dioxide, polysilicon);
- metal etch (Ti , Ni , Ag, Au, Al, W, Cu…);
- UBM (Ag, Ni, Ti...).
- Substrate etch
- thinning;
- stress relief;
- surface conditioning;
- vias reveal.
- Supported substrate types
- Si, SiC, GaN, GaAs, Al2O3, ZnO.
