News: Microelectronics
23 April 2025
Infineon showcasing power device solutions at PCIM
In booth #470 (hall 7) at the Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM 2025) Expo & Conference in Nuremberg, Germany (6–8 May), Infineon Technologies AG of Munich, Germany is showcasing its latest semiconductor, software and tooling solutions that can help to solve green and digital transformation challenges. Highlights from its power device portfolio span all relevant power technologies including silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). Infineon is giving demonstrations and presentations as well as the opportunity to talk to its experts.
Infineon’s PCIM demonstration highlights include solutions in the following areas:
- Silicon and Wide Bandgap (WBG) at its best: Infineon is showcasing its latest package and product developments across Si, SiC and GaN for applications such as AI data-center power supplies, robotics, solar systems, and on-board chargers. Highlights include the new CoolSiC JFET technology, which is said to offer outstanding levels of efficiency, system integration, and robustness for solid-state power distribution applications. Further solutions on display include the CoolSET system-in-package, various innovative solutions in CoolGaN transistor technology and the proven CoolMOS 8 and OptiMOS 8 in silicon.
- Sustainable mobility, with zero-emission electromobility: Infineon’s power solutions accelerate the transition to e-mobility by enabling efficient traction inverters, on-board chargers, DC–DC converters and battery management systems. At PCIM, the firm is showcasing its AURIX Kit for xEV power conversion, a versatile platform for the development of digitally controlled DC–DC converters with different topologies and control methods. In addition, Infineon is presenting new WBG innovations for on-board chargers and DC–DC converters that offer enhanced performance and design flexibility.
- Green, intelligent buildings and smarter living: Residential energy systems such as photovoltaic panels and heat pumps, together with smart, energy-efficient electronic devices and EV chargers, are key to reducing the carbon footprint in the home. Semiconductors play a vital role in enhancing energy efficiency and enabling smart, connected buildings. At PCIM, Infineon is showcasing SiC- and GaN-based technologies that offer high energy efficiency and reliability for energy generation and consumption. On display are full system solutions for solar inverters, as well as demos for power optimization and heat pump boosting.
- Powering AI – from grid to core: The exponential data growth driven by digitalization and AI is increasing the energy demand of data centers. At PCIM, Infineon is showing how its solutions (extending from the grid to the core) leverage Si, SiC and GaN technologies to maximize the efficiency, power density and reliability of AI infrastructure. The portfolio includes top-of-rack switches, power supplies and battery backup units. A power system reliability modeling solution enables real-time health monitoring for data centers, helping to reduce outages and total cost of ownership.
Infineon is also contributing to the PCIM conference program and the various expo stages.
