News: Optoelectronics
2 April 2025
OpenLight partners with TFC to fast-track silicon photonics back-end process
Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers) has announced a new ecosystem partnership with Suzhou TFC Optical Communication Co Ltd (TFC, a provider of optical sub-assembly integrated solutions and advanced optoelectronic package manufacturing services) aimed at advancing the silicon photonics back-end process. The collaboration should streamline the back-end procedure of wafer processing to FAU (fiber array unit) subassembly for optical engines, offering a comprehensive solution to optimize the supply chain and enable faster time-to-market at a lower cost amid growing demand in optical interconnects in data-center AI/ML and LiDAR and sensing markets.
As silicon photonics adoption grows, the entire supply chain must also mature to meet demand, which requires multiple high-volume manufacturing capabilities to be ready for the increasing market need. Currently, a limited number of suppliers can administer the back-end wafer processes to FAU subassembly for optical engines. The ecosystem partnership between OpenLight and TFC will provide a one-stop shop to streamline the supply chain and allow customers to scale manufacturing by creating an efficient workflow and simplified process.
As part of the partnership, OpenLight will support TFC’s development of acquiring completed wafers and provide back-end processes, including wafer-level bumping, testing, grinding and dicing to deliver known-good dies. Customers will have the flexibility to procure the subassemblies directly. With OpenLight's fully heterogeneous integration platform including lasers, amplifiers and modulators all integrated into one photonic integrated circuit (PIC), the partnership would allow customers faster time to market without the need to assemble and attach lasers in the subassembly.
“As part of developing a global ecosystem in packaging silicon photonic integrated circuits including back-end semiconductor wafer processing, we are very pleased to have the support along with the technical and manufacturing capabilities of Suzhou TFC Co Ltd to enable our global customers as well as those customers in the Chinese markets that we serve,” says OpenLight’s CEO Dr Adam Carter. “Bringing TFC’s expertise in high-volume manufacturing capability along with their expertise in passive component technologies and solutions into the OpenLight ecosystem will address the back-end wafer processing and packaging challenges, break barriers and enable broader industry adoption of heterogeneously integrated silicon photonics,” he adds.
“OpenLight plays a key role in boosting customer value through integration that is highly scalable," says TFC’s CEO Lucy Ou. “We are excited to work closely with OpenLight and support growing market demands of the silicon photonics space. By leveraging our combined expertise and resources, we will enable wide adoption of silicon photonics through enhancing the value of the laser engines for PIC and semiconductor OSAT [outsourced semiconductor assembly and test].”
OpenLight completes Telcordia GR-468 qualification for silicon photonics components
