News: Microelectronics
24 April 2025
ROHM adds high-power-density 4-in-1 and 6-in-1 SiC power modules in HSDIP20 package
ROHM has announced the availability of OEM quantities of new 4-in-1 and 6-in-1 silicon carbide (SiC) molded modules in the HSDIP20 package optimized for PFC(power factor correction) and LLC (inductor-inductor-capacitor) converters in on-board chargers (OBC) for xEV electric vehicles. The lineup includes six models rated at 750V (BSTxxx1P4K01) and seven products rated at 1200V (BSTxxx2P4K01). All basic circuits required for power conversion in various high-power applications are integrated into a compact module package, reducing the design workload for manufacturers and enabling the miniaturization of power conversion circuits in OBCs and other applications.
To extend the cruising range and improve the charging speed, electric vehicles are using higher battery voltages, creating demand for higher output from OBCs and DC–DC converters. At the same time, there is an increasing need in the market for greater miniaturization and lighter weight for these applications, requiring technical breakthroughs to improve power density — a key factor — while enhancing heat dissipation characteristics that could otherwise hinder progress. ROHM says that its HSDIP20 package addresses these technical challenges that were previously becoming difficult to overcome with discrete configurations, contributing to both higher output and the downsizing of electric powertrains.
The HSDIP20 features an insulating substrate with what are claimed to be excellent heat dissipation properties that suppresses the chip temperature rise even during high-power operation. When comparing a typical OBC PFC circuit utilizing six discrete SiC MOSFETs with top-side heat dissipation to ROHM’s 6-in-1 module under the same conditions, the HSDIP20 package was verified to be about 38°C cooler (at 25W operation). This high heat dissipation performance supports high currents even in a compact package, achieving what is claimed to be industry-leading power density more than three times higher than top-side-cooled discretes and over 1.4 times that of similar DIP-type modules. As a result, in the PFC circuit mentioned above, the HSDIP20 can reduce mounting area by about 52% compared with top-side-cooled discrete configurations, contributing to the miniaturization of power conversion circuits in applications such as OBCs.
ROHM says that, going forward, it aims to continue to advance the development of SiC modules that balance miniaturization with high efficiency while also focusing on the development of automotive SiC intelligent power modules (IPMs) that provide higher reliability in a smaller form factor.
Example applications
Power conversion circuits like PFC and LLC converters are commonly used in the primary side circuits of industrial equipment, allowing the HSDIP20 to also contribute to the miniaturization of applications in both the industrial and consumer electronics fields.
As well as automotive system applications including on-board chargers and electric compressors, industrial equipment applications include EV charging stations, V2X systems, AC servos, server power supplies, PV inverters, and power conditioners.
ROHM says that it is committed to providing application-level support, including the use of in-house motor testing equipment. Supporting materials are also offered such as simulations and thermal designs that enable quick evaluation and adoption of HSDIP20 products. Two evaluation kits are available as well: one for double-pulse testing and the other for 3-phase full-bridge applications, enabling evaluation under close to actual circuit conditions.
ROHM highlighting e-mobility and industrial applications at PCIM 2025
