News: Suppliers
4 April 2025
Teradyne announces production system for double-sided wafer probe test for silicon photonics
Automated test solutions provider Teradyne Inc of North Reading, MA, USA has partnered with photonics assembly & test equipment provider ficonTEC Service GmbH of Achim, Germany to announce the availability of what is said to be the first high-volume, double-sided wafer probe test cell for silicon photonics. The solution is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications.
The new test cell integrates Teradyne’s UltraFLEXplus automated test equipment (ATE) and programming environment IG-XL with ficonTEC’s advanced optical alignment, probing and wafer handling technologies. The collaboration enables the testing of hybrid bonded PIC/EIC wafers in a production environment.
While the partnership with ficonTEC enables Teradyne to bring a production-ready system to market now, Teradyne says that it is committed to fostering an open ecosystem for silicon photonics and CPO testing. By ensuring that the UltraFLEXplus is compatible with industry-leading optical instrumentation, probers, alignment systems and probe cards, the firm says that it is delivering a seamless and flexible testing environment.
“Our commitment to an open ecosystem ensures our customers can choose the solution that is right for them,” says Regan Mills, president, product test at Teradyne.
The introduction of the double-sided wafer probe test cell is expected to have a significant impact on the silicon photonics and CPO market. By enabling high-throughput electro-optical testing of silicon photonic wafers, the solution addresses the critical need for known good die testing before wafers are diced and packaged into CPO devices or pluggable transceivers.
The integration of Teradyne’s UltraFLEXplus and ficonTEC’s optical alignment and probing technologies is reckoned to ensure that the test cell operates efficiently within the existing fab and OSAT test floor infrastructure, providing a comprehensive and cost-effective solution.
“Our joint effort uniquely combines the class-leading capability of both companies, delivering a high-throughput, cost-effective test solution for silicon photonics and CPO manufacturing workflows,” says Stefano Concezzi, corporate VP at ficonTEC.
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