News: Suppliers
10 February 2025
AlixLabs showcasing latest APS findings at SPIE Advanced Lithography + Patterning
Sweden-based AlixLabs AB (which was spun off from Lund University in 2019) has used its Atomic Layer Etching (ALE) Pitch Splitting technology (APS) technology to etch structures corresponding to commercial 3nm semiconductor processes on test silicon provided by Intel. The results will be shared in full by chief technology officer & co-founder Dmitry Suyatin at the SPIE Advanced Lithography + Patterning trade show in San Jose, CA, USA (23–27 February).
“APS can help the industry lessen its reliance on multi-patterning solutions… while lowering costs and environmental impact,” says Suyatin. “Our tech has been able to produce sub-10nm-class features on silicon, and with the help of Intel’s Test Vehicle Program we have proven that sub-5nm-class features are possible on mass-production silicon by just etching.”
AlixLabs’ APS achieved a 25nm full metal pitch, comparable to 3nm-class technology from the leading foundries, on the Intel Low Global Warming Potential Etch Test Vehicle, representing a milestone on AlixLabs’ road to commercialization, with further developments to follow later in 2025.
“APS proves that there’s no need for complex multi-patterning like SADP and SAQP to produce 5nm chips and beyond,” says Suyatin. “It extends the potential of immersion lithography for use with critical mask layers for even 3nm processes,” says CEO & co-founder Jonas Sundqvist. “These results were produced with our alpha tool, with a beta tool to follow later in 2025,” he adds. “We wish to thank Intel for providing leading-edge grade test silicon for this demonstration.”
AlixLabs collaborates with Linköping University
AlixLabs debuting 300mm APS wafer processing equipment at SEMICON Japan
AlixLabs gains €345,000 grant from Swedish innovation agency Vinnova
EU Intellectual Property Office grants trademark registration for AlixLabs’ APS process
