News: Microelectronics
12 February 2025
Infineon adds Q-DPAK and TOLL packages to industrial CoolSiC MOSFETs 650V G2 range
To support the electronics industry’s shift towards more compact and powerful systems and to further drive innovation at the system level, Infineon Technologies AG of Munich, Germany is expanding its portfolio of discrete CoolSiC MOSFETs 650V with two new product families housed in Q-DPAK and TOLL packages.
Picture: The Q-DPAK package complements the ongoing development of Infineon's new family of Topside Cooled (TSC) products.
The diverse product families, with top- and bottom-side cooling, are based on CoolSiC Generation 2 (G2) technology and offer significantly improved performance, reliability and ease of use. They target high- and medium-power switched-mode power supplies (SMPS) including AI servers, renewable energy, chargers for electric vehicles, e-mobility and humanoid robots, televisions, drives and solid-state circuit breakers.
The TOLL package is said to offer outstanding thermal cycling on board (TCoB) capability, enabling compact system designs by reducing the printed circuit board (PCB) footprint. When used in SMPS, it can also reduce system-level manufacturing costs. The TOLL package now fits an extended list of target applications, enabling PCB designers to further reduce costs and better meet market demands.
The introduction of the Q-DPAK package complements the ongoing development of Infineon’s new family of Topside Cooled (TSC) products, which includes CoolMOS 8, CoolSiC, CoolGaN and OptiMOS. The TSC family enables customers to achieve excellent robustness with maximum power density and system efficiency at low cost. It also enables direct heat dissipation of 95%, allowing the use of both sides of the PCB for better space management and reduction of parasitic effects.
Infineon adds Thin-TOLL 8x8 and TOLT packaged families to CoolSiC MOSFET discretes 650V portfolio
