News: Optoelectronics
12 November 2025
OpenLight presenting heterogeneous integration of silicon and III-Vs for optical interconnects & LiDAR at ISPEC
Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers, modulators, amplifiers and detectors) says that, at the 15th International Symposium on Photonics and Electronics Convergence (ISPEC 2025) at Institute of Science Tokyo (17-18 November), its principal engineer and photonic integrated circuit (PIC) design expert Dr Molly Piels is giving a presentation on the latest advances in the heterogeneous integration of silicon and III-V materials and highlighting how they can be used to enable the fabrication of photonic components at scale. This includes a case study of the OpenLight Photonics Development Kit (PDK) that is helping to underpin growth in photonic IC manufacturing.
ISPEC has been created to provide a forum to discuss recent advances in photonics for future LSI systems and related technologies. Its scope includes designs, fabrication technologies, and characterizations of photonics-electronics convergence systems.
Piels’ presentation ‘Open Market Heterogeneous III-V/Si PDK for High-Speed Optical Interconnects and LiDAR’ begins at 1:15pm on 17 November. She is one of only a handful of presenters from non-academic institutions, which includes Nokia Bell Labs, NEC, NTT and SEI.
“ISPEC is the ideal forum to connect pioneering academic research with industry-leading commercial solutions, and we are very proud to have Dr Piels present our work on an open, scalable model for heterogeneous integration,” says OpenLight’s CEO Adam Carter. “Our PDK-based approach is a key step in enabling this model, enabling our partners to design and manufacture photonic ICs at the speed and volume required by the data-center and automotive markets.”
OpenLight raises $34m in Series A funding round to scale integrated photonics for AI data centers
OpenLight partners with TFC to fast-track silicon photonics back-end process
OpenLight completes Telcordia GR-468 qualification for silicon photonics components
