News: Microelectronics
17 September 2025
ROHM launches DOT-247 2-in-1 SiC molded module
Japan-based ROHM has developed the DOT-247, a 2-in-1 silicon carbide (SiC) molded module (SCZ40xxDTx, SCZ40xxKTx), suitable for industrial applications such as photovoltaic (PV) inverters, uninterruptible power supply (UPS) systems, and semiconductor relays. The module retains the versatility of the widely adopted TO-247 package while achieving high design flexibility and power density.
The DOT-247 features a combined structure consisting of two TO-247 packages. This design enables the use of large chips, which were structurally difficult to accommodate in the TO-247 package, and achieves low on-resistance through a unique internal structure. Additionally, through optimized package structure, thermal resistance has been reduced by about 15% and inductance by about 50% compared with the TO-247. This enables a power density 2.3 times higher than the TO-247 in a half-bridge configuration, achieving the same power conversion circuit in about half the volume.
The new products featuring the DOT-247 package are available in two topologies: half-bridge and common-source. Currently, two-level inverters are the mainstream in PV inverters, but there is growing demand for multi-level circuits such as three-level NPC (neutral point clamped), three-level T-NPC (T-type neutral point clamped), and five-level ANPC (active neutral point clamped) to meet the need for higher voltages. In the switching sections of these circuits, topologies such as half-bridge and common-source are mixed, making custom products necessary in many cases when using conventional SiC modules.
To address this challenge, ROHM has developed each of these two topologies – the smallest building blocks of multi-level circuits – into a 2-in-1 module. This enables flexibility to support various configurations such as NPC circuits and DC–DC converters, while significantly reducing the number of components and mounting area, and achieving circuit miniaturization compared to discrete components.
Evaluation boards will also be made available progressively to facilitate evaluation during application design.
In addition, products compliant with the AEC-Q101 automotive reliability standard are scheduled to begin sample shipments in October.
Application-level support
ROHM says that it is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials is also offered, such as simulations and thermal designs that enable quick evaluation and adoption of DOT-247 products. An evaluation kit for double-pulse testing is already available, allowing immediate testing, while an evaluation kit for 3-phase inverters is currently under preparation, with reference designs scheduled to be released from November.
ROHM adds high-power-density 4-in-1 and 6-in-1 SiC power modules in HSDIP20 package
