News: Optoelectronics
14 April 2026
Photon Bridge and PHIX partner on DWDM external laser sources for hyperscale AI data centers
Photonic integration firm Photon Bridge of Eindhoven, The Netherlands and PhiX B.V. of Enschede, The Netherlands have partnered to advance Photon Bridge’s high-performance DWDM external laser source transmit optical sub-assembly (TOSA), targeting co-packaged optics (CPO) and high-density optical interconnects for AI data-center infrastructure.
Photon Bridge drives end-to-end product development, spanning multi-wavelength external laser source design, photonic integration platform, packaging architecture, and thermal simulation, underpinned by in-house expertise across the optical module stack.
Picture: Photon Bridge DWDM external laser source TOSA.
As a specialized photonic packaging house with a track record of taking advanced designs from prototype through to volume production, PHIX brings complementary capabilities that support Photon Bridge’s path from advanced design to a deployment-ready module. PHIX’s model, which bridges early-stage development to high-volume manufacturing, is said to provide a well-defined and proven route to scale for Photon Bridge’s TOSA.
The collaboration reflects a shared commitment to developing a sustained working relationship within the Dutch photonics ecosystem, and to accelerating the availability of high-performance optical engines for next-generation AI infrastructure.
“Photon Bridge is building a true product company, spanning from the photonic chip to the fully integrated module,” says the firm’s chief operating officer John Anderton. “The market needs a packaged, deployment-ready external laser source, and that is exactly what we are delivering. PHIX’s expertise and their model of developing packages to manufacturing readiness before transferring to volume production gives us a clear and reliable path to scale. Collaborating with world-class partners in our local ecosystem is central to how we operate,” he adds.
“Their full-stack photonic integration approach aligns strongly with the demands of CPO and AI interconnects,” comments PHIX’s chief techhnology officer Jeroen Duis. “At PHIX, we enable innovative photonics companies to transition efficiently from advanced design to volume packaging.”
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